第五届大数据与人工智能会议

2022 IEEE the 5th International Conference on Big Data and Artificial Intelligence (BDAI)

Fuzhou, China | 中国，福州

July 08-10, 2022 | 2022年7月8-10日

ABOUT BDAI | 大数据与人工智能

In recent years, “Artificial Intelligence” together with "Big Data" are reshaping science, engineering, medicine, healthcare, finance, business, and ultimately our society itself. Artificial Intelligence is a branch of computer science that aims to create intelligent machines that can simulate, support, enhance, or even upgrade human intelligence. Much of AI's growth has occurred in the last decade. With the trends of big data, we can see many new AI applications being developed that match better with the realistic requirements from applications in the real world. The upcoming decade will bring along the greatest technological revolution in man's history.

2022 IEEE the 5th International Conference on Big Data and Artificial Intelligence (BDAI) will be held in Fuzhou, China during July 08-10, 2022. The aim of BDAI 2022 is to set up a forum for scholars, researchers & scientists to present their latest research work and results of in related fields of Big Data and Artificial Intelligence.

BDAI2022 is co-sponsored by Research Institute of Big Data Analytics at XJTLU, Fuzhou University and IEEE, hosted by Fuzhou University, and assisted by Fujian Normal University, Hohai University, Ocean University of China, Shenzhen University etc. BDAI2022由西交利物浦大学大数据分析研究院,福州大学和IEEE联合主办，福州大学承办; 福建师范大学，河海大学，中国海洋大学，深圳大学等高校协办。

近年来,“大数据”已经无处不在。大数据改变科学、工程、医学、医疗、金融、商业、以及我们社会本身。人工智能是计算机科学的一个分支,旨在创建自学的智能机器。在过去十年，人工智能已经不断发展。也将成为人类历史上最伟大的技术革命在即将到来的十年里。第五届大数据与人工智能国际会议将于2022年7月8日-10日在中国福州召开。会议旨在促进大数据与人工智能等领域的学术交流与合作，热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。

Co-sponsored by                                                                                                    

Hosted by

Patrons

Conference Proceedings | 论文集

All submissions will be peer reviewed, and the accepted papers will be published in the BDAI2022 Conference Proceedings by IEEE, Conference content will be submitted for inclusion into IEEE Xplore and indexed by Ei Compendex and Scopus, as well as other Abstracting and Indexing (A&I) databases.
BDAI会议论文集将由IEEE出版，并提交Ei核心和Scoups检索。 文章作者将被邀请参会做口头报告。

!! BDAI 2022 has been listed on the IEEE conference list! | 会议进入IEEE官方会议列表 ！
https://conferences.ieee.org/conferences_events/conferences/conferencedetails/56143

BDAI2021 - ISBN: 978-1-6654-1269-8 - IEEE Xplore Online | Ei-Compendex & Scopus (Ei核心检索和Scopus收录)  
BDAI2020 - ISBN: 978-1-4503-7560-3 - ACM Digital Library | Ei-Compendex & Scopus (Ei核心检索和Scopus收录)
BDAI2019 - ISBN: 978-1-4503-7185-8 - ACM Digital Library | Ei-Compendex & Scopus (Ei核心检索和Scopus收录)
BDAI2018 - ISBN: 978-1-5386-6136-9 - IEEE Xplore Online | Ei-Compendex & Scopus (Ei核心检索和Scopus收录)

Submission Details | 投稿详情

1. Template Download (模板下载) here
2. Prepare your manuscript in English. Please ensure that your manuscript does not contain grammatical and language errors.
3. All third party work included in your paper should be properly acknowledged with referencing.
4. The manuscripts should be submitted as a PDF document in .pdf format.
5. Upload your paper to Electronic Submission System (投稿链接) on or before the deadline.

欢迎点击投稿链接进行系统投稿（全文或者摘要），只有全文投稿才有出版资格。

BDAI Calendar | 重要日期

Special Issues | 特刊

Selected registered & presented papers with extension will be recommended to be published in a special issue of IEEE/CAA Journal of Automatica Sinica (JAS) 《自动化学报(英文版)》(http://www.ieee-jas.net/). ISSN 2329-9266 | SCI IF: 5.129, Q1 | CiteScore: 8.3, Q1 Indexed by the Science Citation Index Expanded (SCIE)，IEEE Xplore, EI, Scopus, etc. IEEE/CAA Journal of Automatica Sinica (JAS) 创刊于2014年，由中国自动化学会、中国科学院自动化研究所主办，与IEEE合作，报道自动控制、人工智能、机器人等领域热点和前沿方向的研究成果。JAS被SCI, EI, Scopus等数据库收录，是ESI刊源期刊，也是自动化与控制系统领域唯一的中国主办Q1区SCI期刊。2019年首个JCR影响因子5.129，在自动化与控制领域全球63种SCI期刊中排名第11（前17%），位列Q1区。2019年CiteScore为8.3，位于所属各领域Q1区前列；国内外综合他引影响因子为6.688，在自动化、计算机领域的中国英文期刊中排名第1。

Selected registered & presented papers with extension will be recommended to be published in a special issue of Selected Papers from BDAI 2022 with the MDPI Applied Sciences (ISSN: 2076-3417). Impact Factor: 2.679 (2020) ; 5-Year Impact Factor: 2.736 (2020) | CiteScore: 3.0, JCR - Q2 / CiteScore - Q2 Indexed by the Scopus, SCIE (Web of Science), Inspec, CAPlus / SciFinder, and many other databases.

Call for Papers | 征稿启事

The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. Topics of interest for submission include, but are not limited to: